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AF-PDA@h-BN二元纸基复合材料导热绝缘性能的研究
The Study of Thermal Conductivity and Insulation Properties of AF-PDA@h-BN Binary Paper-based Composite
  
DOI:10.11980/j.issn.0254-508X.2018.11.002
关键词:  多巴胺  六方氮化硼  体积电阻率  导热系数
Key Words:dopamine  hexagonal boron nitride  volume resistivity  thermal conductivity
基金项目:陕西省重点实验室科技计划( 12JS018) ; 陕西省科技厅统筹创新工程计划项目( 2016KTCQ01-87)。
作者单位
秦盼亮 陕西科技大学轻工科学与工程学院陕西西安710021 
谢 璠 陕西科技大学轻工科学与工程学院陕西西安710021 
张 楠 陕西科技大学轻工科学与工程学院陕西西安710021 
陆赵情* 陕西科技大学轻工科学与工程学院陕西西安710021 
王亚芳 陕西科技大学轻工科学与工程学院陕西西安710021 
司联蒙 陕西科技大学轻工科学与工程学院陕西西安710021 
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摘要:以芳纶沉析纤维(AF)为基体,盐酸多巴胺(DA)改性的六方氮化硼(h-BN)为导热填料,采用真空辅助抽滤的方式制备了AF-PDA@h-BN二元纸基复合材料。通过X射线能谱仪(EDS)、激光显微拉曼成像光谱仪和傅里叶变换红外光谱仪(FT-IR)分析了PDA@h-BN的结构。通过扫描电子显微镜(SEM)观察了PDA@h-BN在纸基复合材料内部的分布;通过体积电阻率测试仪和导热系数测试仪分别对纸基复合材料的绝缘性能和导热性能进行了分析表征。结果表明,h-BN被DA成功改性;当PDA@h-BN的用量为15%时,原纸的导热系数从0.12 W/(m·K)上升至0.33 W/(m·K),增加幅度为175%;同时,二元纸基复合材料的体积电阻率随着PDA@h-BN用量的增加而逐渐增加,由原纸的4.63×1013 Ω·m上升至5.60×1014 Ω·m,表明制备的二元纸基复合材料具有优异的导热绝缘性能。
Abstract:By using aramid fabric (AF) fibrid as matrix, hexagonal boron nitride (h-BN) modified by dopamine (DA) as the thermal conductive filler the AF-PDA@h-BN binary paper-based composite was prepared with vacuum-assisted filtration. The successful modification of h-BN by dopamine (DA) was characterized by energy disperse spectroscopy (EDS), laser Raman spectrograph and fourier infrared spectrometer (FT-IR). The distribution of PDA@h-BN in the paper-based composite was observed by scanning electron microscope (SEM). The insulation performance and thermal conductivity of paper-based composite were analyzed and characterized by the volume resistivity tester and thermal conductivity tester. The experimental results showed that the thermal conductivity achieved a 175% enhance from 0.12 W/(m·k) of the pristine paper to 0.33 W/(m·k) when the content of PDA@h-BN was 15%. Meanwhile, the volume resistivity of the prepared binary paper-based composites increased with the increase of PDA@h-BN content, the binary composite paper volume resistivity increased from 4.63×1013 Ω·m of base paper to 5.60×1014 Ω·m. The results indicated that the prepared binary paper-based composites had excellent thermal conductivity and insulation properties.
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