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用于浸渍聚酰亚胺纤维纸基复合材料树脂的研究
Preparation of the Resin Used for Reinforcing Polyimide FiberPaper-based Composites
投稿时间:2020-01-08  
DOI:10.11980/j.issn.0254-508X.2020.06.001
关键词:  聚酰亚胺纤维  环氧树脂  有机硅树脂  聚酰亚胺树脂  纸基材料
Key Words:polyimide fibre  epoxy resin  silicone resin  polyimide resin  paper-based material
基金项目:国家重点研发计划项目(2017YFB0308301)。
作者单位邮编
王军 大连工业大学轻工与化学工程学院辽宁大连116034 116034
平清伟 大连工业大学轻工与化学工程学院辽宁大连116034 116034
张健 大连工业大学轻工与化学工程学院辽宁大连116034 116034
盛雪茹 大连工业大学轻工与化学工程学院辽宁大连116034 116034
李娜 大连工业大学轻工与化学工程学院辽宁大连116034 116034
石海强 大连工业大学轻工与化学工程学院辽宁大连116034 116034
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摘要:为了提升聚酰亚胺纤维纸基材料的强度、耐高温性、韧性及阻隔性能,本研究制备了具有高黏附力、易固化、柔韧性好、耐高温的浸渍树脂。首先用乙烯基硅树脂改性环氧树脂,以提高浸渍树脂的韧性及固化性,然后进一步添加聚酰亚胺树脂制备耐高温的三元合金树脂。结果表明,当乙烯基硅树脂用量30%时,改性后环氧树脂有较好的韧性及交联程度;此改性环氧树脂添加5%聚酰亚胺树脂时,三元合金树脂质量损失5%时的温度为339.2℃,并且在高温下没有明显的玻璃化转变。分别用改性环氧树脂和三元合金树脂浸渍聚酰亚胺纤维纸基复合材料,结果表明,改性环氧树脂浸渍的纸基复合材料纤维结合程度较好,表面平整,接触角可以达到148.71°,三元合金树脂浸渍的纸基复合材料耐高温效果好,200℃时纸基复合材料抗张指数仍能达到35.1 N·m/g。
Abstract:In order to improve the strength, high temperature resistance, toughness and barrier properties of polyimide fiber paper-based materials, the impregnating resin with high adhesion, easy curing, good flexibility and high temperature resistance was prepared. First, the epoxy resin modified by vinyl silicone resin was prepared to improve the toughness and curing property of the impregnated resin. Then polyimide resin was added to prepare the superalloy resin. The results showed that when 30% of vinyl silicone was used, the modified resin had better toughness and crosslinking degree, then 5% polyimide resin was added, 5% resin mass loss temperature was 339.2℃, and there was no significant glass transition at high temperature. The prepared resins were respectively used to impregnate paper-based material made of polyimide fiber, the results showed that the paper impregnated by vinyl silicone modified epoxy resin had good bonding strength, and the contact angle reached 148.71° due to the smooth surface, the enhancement effect of alloy resin was obvious at high temperature, the tensile index of paper reached 35.1 N·m/g at 200℃.
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