芳纶纳米纤维/壳聚糖绝缘复合薄膜力学及绝缘性能研究

Study on the Mechanics and Electrical Insulation Properties of ANFs/CS Insulating Composite Film

关键词:  芳纶纳米纤维  壳聚糖  复合薄膜  力学性能  绝缘性能

Key Words:aramid nanofibers  chitosan  composite film  mechanical properties  insulation properties

摘要:以芳纶纳米纤维（ANFs）为基体，壳聚糖（CS）为增强剂，采用真空辅助过滤技术制备了ANFs/CS复合薄膜，并通过热压法提高薄膜的致密性，以增强其力学和绝缘性能。结果显示，当壳聚糖负载量为0.02 g时，ANFs/CS复合薄膜的性能最优，其最大拉伸强度可达208 MPa，特征击穿强度62 kV/mm。对ANFs/CS复合薄膜进行热压处理后，复合薄膜的致密性明显提高，其最大拉伸强度和击穿强度分别为253 MPa和109 kV/mm，相较于热压前分别提升了21.6%和75.8%。

Abstract:Using aramid nanofibers （ANFs） as matrix and chitosan （CS） as reinforcing agent， ANFs/CS composite films were prepared by vacuum-assisted filtration technology. The densification of the films was improved by hot pressing to enhance the mechanical and electrical insulation properties of films. The results showed that the maximum tensile strength and the characteristic breakdown strength of ANFs/CS composite films reached 208 MPa and 62 kV/mm with 0.02 g chitosan loading， respectively， exhibiting the best performance. After hot pressing， the densification of ANFs/CS composite films was improved significantly. The maximum tensile strength and breakdown strength of ANFs/CS composite films reached 253 MPa and 109 kV/mm， respectively， which increased by 21.6% and 75.8% compared with the films before hot pressing.