阳离子化纤维素/改性氮化硼纳米片复合纸的制备和导热性能研究
Preparation and Thermal Conductivity Study of Cationic Cellulose/Modified Boron Nitride Nanosheet Composite Paper
投稿时间:2024-10-22  修订日期:2024-12-09
DOI:
关键词:  阳离子纤维素,3-氯-2-羟丙基三甲基氯化铵,氮化硼纳米片,复合纸
Key Words:Cationic cellulose  3-chloro-2-hydroxypropyl trimethyl ammonium chloride  boron nitride nanosheets  Composite Paper
基金项目:陕西科技大学自然科学前沿研究基金(2020XSGG-07);陕西省重点研发计划(2022GY-278);陕西省自然科学基础研究计划(2023-JC-YB-104);广西清洁化制浆造纸与污染控制重点实验室开放基金(2023GXZZKF36)。
作者单位邮编
李明琴 陕西科技大学轻工科学与工程学院 710021
田秀枝 陕西科技大学轻工科学与工程学院 
蒋兵 江苏金辰针纺织有限公司 
拜浩哲 老虎表面技术新材料苏州有限公司 
高新宇 老虎表面技术新材料苏州有限公司 
刘沛廷 陕西科技大学轻工科学与工程学院 
刘流 陕西科技大学轻工科学与工程学院 
蒋学* 陕西科技大学轻工科学与工程学院 710021
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摘要:纤维素纸是柔性可降解的二维材料,在新型可穿戴器件等领域研究广泛,但纸导热系数低,加填氮化硼纳米片(BNNS)后可改善其导热性。然而直接加填BNNS存在留着率低且分布不均匀、难以形成大量导热通路的问题,因此所得纸张导热系数较小。本研究采用阳离子化纤维素纸浆(CMCF)结合壳寡糖改性氮化硼纳米片(COSBNNSs),利于导热通路的形成。利用3-氯-2-羟丙基三甲基氯化铵和木浆纤维素反应制备阳离子化纤维,壳寡糖辅助六方氮化硼球磨制备COSBNNSs。COSBNNSs通过静电吸附,物理吸附等作用留着在基材(CMCF)中。当COSBNNSs添加量达到30 %时,所获得CMCF/COSBNNSs复合纸达到最高导热率2.07 W/m*K,抗张强度30 MPa,机械强度和热导率较高,具有作为热管理基材的潜力。
Abstract:Cellulose paper is a flexible and biodegradable two-dimensional material widely studied in fields such as novel wearable devices. However, its thermal conductivity is low, which can be improved by adding boron nitride nanosheets (BNNS). Directly incorporating BNNS presents challenges such as low retention rates and uneven distribution, making it difficult to establish sufficient thermal conduction pathways, resulting in a lower thermal conductivity for the paper. In this study, cationic cellulose pulp (CMCF) was combined with chitosan-modified boron nitride nanosheets (COSBNNSs) to facilitate the formation of thermal conduction pathways. Cationic cellulose was prepared by reacting 3-chloro-2-hydroxypropyl trimethyl ammonium chloride with wood pulp cellulose, while COSBNNSs were synthesized using chitosan-assisted ball milling of hexagonal boron nitride. COSBNNSs were retained in the substrate (CMCF) through electrostatic and physical adsorption. When the content of COSBNNSs reached 30%, the resulting CMCF/COSBNNSs composite paper achieved a maximum thermal conductivity of 2.07 W/m*K and a tensile strength of 30 MPa, demonstrating high mechanical strength and thermal conductivity, thus showing potential as a thermal management substrate.
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