涂布烘箱温度场特性分析与结构优化
Analysis of Temperature Field Characteristics and Structural Optimization of Coating Oven
投稿时间:2024-11-07  修订日期:2024-12-20
DOI:
关键词:  涂布机烘箱  仿真分析  温度场特性分析  结构优化
Key Words:Coating machine oven  analogue simulation  analysis of temperature field characteristics  structural optimization
基金项目:2024年陕西省重点项目-关键核心技术攻关-区域创新能力提升(2024QY2-GJHX -29)
作者单位邮编
邝沿 西安理工大学印刷包装与数字媒体学院 710048
侯和平* 西安理工大学印刷包装与数字媒体学院 710048
孙玉香 西安理工大学印刷包装与数字媒体学院 
刘善慧 西安理工大学印刷包装与数字媒体学院 
张义明 渭南正奇印刷包装机械有限公司 
景辉 西安理工大学 
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摘要:为提高涂布干燥系统的干燥性能,本文利用三维建模和流体仿真软件对涂布机烘箱流场进行仿真,分析结果发现了烘箱流场存在长度方向上温度不均匀且各风嘴处温度方差较大的问题。针对以上问题,从导流板圆角半径、烘箱进风口位置及导流板数量方面入手对烘箱结构进行优化并设计多组对比仿真实验,得到了增大导流板圆角半径会使导流板背面紧邻两处风嘴的温度有所提升,烘箱进风口位置的改变对基材表面温度分布有明显提升,增加导流板数量并合理设置其结构尺寸及空间位置使得热风在烘箱风室中部位置的滞留可降低基材表面温度数值分布的结果。并依据以上结论设计了一种烘箱模型,将各风嘴处平均温度差由±4.5℃降低至±2.5℃,为后续烘箱设计或优化提供借鉴和理论依据。
Abstract:In order to improve the drying performance of the coating drying system, 3D modeling and fluid simulation software are used to simulate the flow field of the drying oven of the coating machine. The analysis results show that the temperature of the drying oven flow field is uneven in the length direction and the temperature variance at each nozzle is large. Aiming at the above problems, the structure of the oven was optimized from the Angle radius of the baffle, the position of the air inlet and the number of the baffle. It was found that increasing the corner radius of the baffle would increase the temperature of the two air noses close to the back of the baffle, and the change of the position of the air inlet of the oven would significantly increase the temperature distribution on the surface of the substrate. Increasing the number of baffle and rationally setting its structure size and space position can reduce the temperature distribution of the substrate surface by making the hot air stay in the middle of the air chamber of the oven. According to the above conclusions, an oven model is designed to reduce the average temperature difference at each air nozzle from ±4.5℃ to ±2.5℃, which can provide reference and theoretical basis for subsequent oven design or optimization.
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